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Equipment Selection
選了A區就不能選B區
以光學或EUV曝光方式，將電路設計精準轉印到晶圓表面的光阻層，是決定線寬與結構的關鍵製程。
Using optical or EUV exposure to precisely transfer circuit designs onto the photoresist layer of the wafer surface, this is a key process that determines line width and structure.
利用等離子體或反應性氣體選擇性去除材料，能實現高方向性，形成精細結構並保留電路完整度。
Using plasma or reactive gases to selectively remove materials, enabling high directionality to form fine structures while preserving circuit integrity.
透過PVD、CVD或ALD等方式，在晶圓堆疊導體、絕緣體薄膜，提供電性與結構基礎。
Through PVD, CVD, or ALD methods, depositing conductor and insulator thin films on wafers to provide electrical and structural foundations.
使用光學或電子顯微技術檢查線寬、厚度與缺陷，確保製程精度與晶片良率，並提供迴饋控制。
Using optical or electron microscopy techniques to inspect line width, thickness, and defects, ensuring process precision and chip yield while providing feedback control.
利用高溫環境促進材料擴散、應力釋放或薄膜結晶化，常見製程包含氧化（Oxidation）、退火（Annealing）與快速熱處理（RTP），用以改善材料電性與結構品質。
Using high-temperature environments to promote material diffusion, stress relief, or thin film crystallization. Common processes include oxidation, annealing, and rapid thermal processing (RTP) to improve material electrical properties and structural quality.
以化學溶液進行清洗、蝕刻或表面修飾，去除微粒、金屬汙染與有機殘留，確保後續製程的表面潔淨度與可靠度。
Using chemical solutions for cleaning, etching, or surface modification to remove particles, metal contamination, and organic residues, ensuring surface cleanliness and reliability for subsequent processes.
提供製程輔助與分析用儀器，如真空系統、氣體供應設備、化學濕站、光學顯微鏡與環境監測儀器，確保製程穩定與安全。
Providing process support and analytical instruments such as vacuum systems, gas supply equipment, chemical wet stations, optical microscopes, and environmental monitoring instruments to ensure process stability and safety.
其他半導體製造相關製程設備。
Other semiconductor manufacturing related process equipment.
